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| TECHNICAL DATA IN74HC125A Quad 3-State Noninverting Buffers The IN74HC125A is identical in pinout to the LS/ALS125. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. The IN74HC125A noninverting buffers are designed to be used with 3state memory address drivers, clock drivers, and other bus-oriented systems. The devices have four separate output enables that are active-low. * Outputs Directly Interface to CMOS, NMOS, and TTL * Operating Voltage Range: 2.0 to 6.0 V * Low Input Current: 1.0 A * High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC125AN Plastic IN74HC125AD SOIC TA = -55 to 125 C for all packages LOGIC DIAGRAM PIN ASSIGNMENT FUNCTION TABLE Inputs A PIN 14 =VCC PIN 7 = GND H L X OE L L H Output Y H L Z X = don't care Z = high impedance Rev. 00 IN74HC125A MAXIMUM RATINGS* Symbol VCC VIN VOUT IIN IOUT ICC PD Tstg TL * Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) Value -0.5 to +7.0 -1.5 to VCC +1.5 -0.5 to VCC +0.5 20 35 75 750 500 -65 to +150 260 Unit V V V mA mA mA mW C C Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/C from 65 to 125C SOIC Package: : - 7 mW/C from 65 to 125C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT TA tr, tf Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min 2.0 0 -55 0 0 0 Max 6.0 VCC +125 1000 500 400 Unit V V C ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or VOUT)VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74HC125A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions V Guaranteed Limit 25 C to -55C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.1 0.5 85 C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 1.0 5.0 125 C 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 1.0 10 A A V Unit VIH Minimum HighLevel Input Voltage Maximum Low Level Input Voltage Minimum HighLevel Output Voltage VOUT= VCC-0.1 V IOUT 20 A VOUT=0.1 V IOUT 20 A VIN=VIH IOUT 20 A VIN=VIH IOUT 6.0 mA IOUT 7.8 mA 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 V VIL V VOH V VOL Maximum LowLevel Output Voltage VIN=VIL IOUT 20 A VIN=VIL IOUT 6.0 mA IOUT 7.8 mA IIN IOZ Maximum Input Leakage Current Maximum ThreeState Leakage Current Maximum Quiescent Supply Current (per Package) VIN=VCC or GND Output in High-Impedance State VIN=VIL or VIH VIN=VCC or GND VIN=VCC or GND IOUT=0A ICC 6.0 4.0 40 160 A Rev. 00 IN74HC125A AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns) VCC Symbol Parameter V Guaranteed Limit 25 C to -55C 90 18 15 120 24 20 90 18 15 60 12 10 10 15 85C 125C Unit tPLH, tPHL Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) Maximum Propagation Delay, Output Enable toY (Figures 2 and 4) Maximum Propagation Delay, Output Enable toY (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 3) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High-Impedance State) Power Dissipation Capacitance (Per Buffer) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 115 23 20 150 30 26 115 23 20 75 15 13 10 15 135 27 23 180 36 31 135 27 23 90 18 15 10 15 ns tPLZ, tPHZ ns tPZL, tPZH ns tTLH, tTHL ns CIN COUT pF pF Typical @25C,VCC=5.0 V 45 pF CPD Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC Figure 1. Switching Waveforms Figure 2. Switching Waveforms Rev. 00 IN74HC125A Figure 3. Test Circuit Figure 4. Test Circuit EXPANDED LOGIC DIAGRAM (1/4 of the Device) Rev. 00 IN74HC125A N SUFFIX PLASTIC DIP (MS - 001AA) A 14 8 B 1 7 Dimension, mm Symbol A B C MIN 18.67 6.1 MAX 19.69 7.11 5.33 0.36 1.14 2.54 7.62 0 2.92 7.62 0.2 0.38 10 3.81 8.26 0.36 0.56 1.78 F L D F C -T- SEATING N G D 0.25 (0.010) M T K PLANE G H H J M J K L M N NOTES: 1. Dimensions "A", "B" do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D SUFFIX SOIC (MS - 012AB) Dimension, mm 8 A 14 Symbol A MIN 8.55 3.8 1.35 0.33 0.4 1.27 5.27 0 0.1 0.19 5.8 0.25 MAX 8.75 4 1.75 0.51 1.27 H B P B C 1 G 7 C R x 45 D F G -TD 0.25 (0.010) M T C M K SEATING PLANE H J F M J K M P R 8 0.25 0.25 6.2 0.5 NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B 0.25 mm (0.010) per side. Rev. 00 |
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